We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

IDT72V263L6BC vs IDT72V263L6PF feature comparison

IDT72V263L6BC Integrated Device Technology Inc

Buy Now Datasheet

IDT72V263L6PF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA QFP
Package Description LBGA, BGA100,10X10,40 PLASTIC, TQFP-80
Pin Count 100 80
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Date Of Intro 1998-11-01
Access Time-Max 4 ns 4 ns
Additional Feature IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Alternate Memory Width 9 9
Clock Frequency-Max (fCLK) 166 MHz 166 MHz
Cycle Time 6 ns 6 ns
JESD-30 Code S-PBGA-B100 S-PQFP-G80
JESD-609 Code e0 e0
Length 11 mm 14 mm
Memory Density 147456 bit 147456 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX18 8KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Equivalence Code BGA100,10X10,40 QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.6 mm
Standby Current-Max 0.015 A 0.015 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn85Pb15)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Width 11 mm 14 mm
Base Number Matches 1 1
Memory » FIFOs
Memory » FIFOs

Compare IDT72V263L6BC with alternatives

Compare IDT72V263L6PF with alternatives