IDT72V241L15JG vs IDT72V241L15J8 feature comparison

IDT72V241L15JG Integrated Device Technology Inc

Buy Now Datasheet

IDT72V241L15J8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCJ, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Cycle Time 15 ns 15 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e3 e0
Length 13.9954 mm 13.9954 mm
Memory Density 36864 bit 36864 bit
Memory Width 9 9
Moisture Sensitivity Level 3 1
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 4KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 3.55 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Width 11.4554 mm 11.4554 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 66.7 MHz
Memory IC Type OTHER FIFO
Package Equivalence Code LDCC32,.5X.6
Standby Current-Max 0.005 A
Supply Current-Max 0.02 mA

Compare IDT72V241L15JG with alternatives

Compare IDT72V241L15J8 with alternatives