IDT72V241L15JG vs 72V241L15PFGI feature comparison

IDT72V241L15JG Integrated Device Technology Inc

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72V241L15PFGI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ TQFP
Package Description QCCJ, TQFP-32
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Cycle Time 15 ns 15 ns
JESD-30 Code R-PQCC-J32 S-PQFP-G32
JESD-609 Code e3 e3
Length 13.9954 mm 7 mm
Memory Density 36864 bit 36864 bit
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX9 4KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 11.4554 mm 7 mm
Base Number Matches 4 3
Manufacturer Package Code PRG32
Clock Frequency-Max (fCLK) 66.7 MHz
Memory IC Type OTHER FIFO
Package Equivalence Code QFP32,.35SQ,32
Standby Current-Max 0.005 A
Supply Current-Max 0.02 mA

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Compare 72V241L15PFGI with alternatives