IDT72V24115PFGI
vs
72V241L15JG
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFJ
Package Description
LQFP,
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
10 ns
10 ns
Cycle Time
15 ns
15 ns
JESD-30 Code
S-PQFP-G32
R-PQCC-J32
JESD-609 Code
e3
e3
Length
7 mm
13.9954 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4KX9
4KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
3.556 mm
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
7 mm
11.4554 mm
Base Number Matches
1
8
Clock Frequency-Max (fCLK)
66.7 MHz
Package Equivalence Code
LDCC32,.5X.6
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.005 A
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT72V24115PFGI with alternatives
Compare 72V241L15JG with alternatives