IDT72V235L15PFG vs 72235LB15TFI9 feature comparison

IDT72V235L15PFG Integrated Device Technology Inc

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72235LB15TFI9 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description QFP, PLASTIC, STQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 50 ns
Additional Feature EASILY EXPANDABLE IN DEPTH AND WIDTH
Cycle Time 15 ns 65 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Length 14 mm 10 mm
Memory Density 36864 bit 9216 bit
Memory Width 18 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 2048 words 2048 words
Number of Words Code 2000 1000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2KX18 1KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 14 mm 10 mm
Base Number Matches 4 2
Memory IC Type OTHER FIFO
Supply Current-Max 0.08 mA

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Compare 72235LB15TFI9 with alternatives