IDT72V2105L20PF9 vs IDT72V2105L20PFG8 feature comparison

IDT72V2105L20PF9 Integrated Device Technology Inc

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IDT72V2105L20PFG8 Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description PLASTIC, TQFP-64 LQFP,
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 12 ns 12 ns
Additional Feature EASILY EXPANDABLE IN DEPTH AND WIDTH EASILY EXPANDABLE IN DEPTH AND WIDTH
Cycle Time 20 ns 20 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e0 e3
Length 14 mm 14 mm
Memory Density 4718592 bit 4718592 bit
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 256KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 14 mm 14 mm
Base Number Matches 1 1

Compare IDT72V2105L20PF9 with alternatives

Compare IDT72V2105L20PFG8 with alternatives