IDT72T72115L6-7BBGI
vs
72V2113L7-5BCG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA,
BGA,
Pin Count
324
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
S-PBGA-B324
S-PBGA-B100
JESD-609 Code
e1
e1
Length
19 mm
Memory Density
9437184 bit
4718592 bit
Memory Width
72
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
324
100
Number of Words
131072 words
262144 words
Number of Words Code
128000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX72
256KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.97 mm
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
19 mm
Base Number Matches
1
1
Access Time-Max
5 ns
Additional Feature
AUTO POWER DOWN; RETRANSMIT; IT CAN ALSO BE CONFIGURED AS 512K X 9; ASYNCHRONOUS MODE ALSO POSSIBLE
Cycle Time
7.5 ns
Peak Reflow Temperature (Cel)
260
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT72T72115L6-7BBGI with alternatives
Compare 72V2113L7-5BCG with alternatives