IDT72T55258L6-7BB
vs
72T55258L6-7BBI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
PBGA
Package Description
19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
Pin Count
324
324
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
3.8 ns
3.8 ns
Clock Frequency-Max (fCLK)
200 MHz
200 MHz
Cycle Time
6.7 ns
6.7 ns
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e0
e0
Length
19 mm
19 mm
Memory Density
2621440 bit
2621440 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
40
40
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
324
324
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
64KX40
64KX40
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,18X18,40
BGA324,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.97 mm
Supply Current-Max
0.33 mA
0.33 mA
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
19 mm
Base Number Matches
1
1
Pbfree Code
Manufacturer Package Code
BB324
Compare IDT72T55258L6-7BB with alternatives
Compare 72T55258L6-7BBI with alternatives