IDT72T36115L5BB
vs
IDT72T36115L10BB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA240,18X18,40
BGA, BGA240,18X18,40
Pin Count
240
240
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
3.6 ns
4.5 ns
Additional Feature
ASYNCHRONOUS OPERATION ALSO POSSIBLE
ASYNCHRONOUS OPERATION ALSO POSSIBLE
Clock Frequency-Max (fCLK)
200 MHz
100 MHz
Cycle Time
5 ns
10 ns
JESD-30 Code
S-PBGA-B240
S-PBGA-B240
JESD-609 Code
e0
e0
Length
19 mm
19 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
36
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
240
240
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX36
128KX36
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA240,18X18,40
BGA240,18X18,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.97 mm
Standby Current-Max
0.01 A
0.01 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
2.625 V
2.625 V
Supply Voltage-Min (Vsup)
2.375 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
19 mm
19 mm
Base Number Matches
1
1
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