IDT7290820BC
vs
MT9080BPR1
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MICROSEMI CORP
|
| Part Package Code |
BGA
|
LCC
|
| Package Description |
11 X 11 MM, 1 MM PITCH, BGA-100
|
|
| Pin Count |
100
|
84
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B100
|
S-PQCC-J84
|
| JESD-609 Code |
e0
|
|
| Length |
11 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
84
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
QCCJ
|
| Package Equivalence Code |
BGA100,10X10,40
|
LDCC84,1.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Current-Max |
0.075 mA
|
200 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
DIGITAL TIME SWITCH
|
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
|
| Terminal Form |
BALL
|
J BEND
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11 mm
|
|
| Base Number Matches |
1
|
2
|
| Technology |
|
CMOS
|
|
|
|
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