IDT7280L30JB vs CY7C419-10JC feature comparison

IDT7280L30JB Integrated Device Technology Inc

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CY7C419-10JC Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ROCHESTER ELECTRONICS INC
Part Package Code QFJ QFJ
Package Description QCCJ, QCCJ,
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 65 ns 10 ns
Cycle Time 80 ns 20 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0 e0
Length 13.97 mm 13.97 mm
Memory Density 36864 bit 2304 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 256 words 256 words
Number of Words Code 4000 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4KX9 256X9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Screening Level MIL-STD-883 Class B
Seated Height-Max 3.55 mm 3.55 mm
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Base Number Matches 1 2
Additional Feature RETRANSMIT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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