IDT7280L25JI vs 7200L25JI feature comparison

IDT7280L25JI Integrated Device Technology Inc

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7200L25JI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ PLCC
Package Description QCCJ, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 65 ns 25 ns
Cycle Time 80 ns 35 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0 e0
Length 13.97 mm 13.97 mm
Memory Density 36864 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 256 words 256 words
Number of Words Code 4000 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4KX9 256X9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 3.55 mm
Supply Current-Max 0.07 mA 0.125 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Base Number Matches 1 1
Manufacturer Package Code PL32
Additional Feature RETRANSMIT
Clock Frequency-Max (fCLK) 28.5 MHz
Package Equivalence Code LDCC32,.5X.6
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.0005 A
Time@Peak Reflow Temperature-Max (s) 20

Compare IDT7280L25JI with alternatives

Compare 7200L25JI with alternatives