IDT72521L25J vs SN74ACT7802-28.5FN feature comparison

IDT72521L25J Integrated Device Technology Inc

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SN74ACT7802-28.5FN Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code LCC
Package Description PLASTIC, LCC-68 QCCJ,
Pin Count 68
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns
Additional Feature BYPASS XCVR
Clock Frequency-Max (fCLK) 28.6 MHz
Cycle Time 35 ns
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e0
Length 24.2062 mm 24.2316 mm
Memory Density 18432 bit 18432 bit
Memory IC Type BI-DIRECTIONAL FIFO
Memory Width 18 18
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX18 1KX18
Output Characteristics 3-STATE 3-STATE
Output Enable NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Supply Current-Max 0.23 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm 24.2316 mm
Base Number Matches 1 1

Compare IDT72521L25J with alternatives

Compare SN74ACT7802-28.5FN with alternatives