IDT72511L25J
vs
IDT72225L50GB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
LCC
|
PGA
|
| Package Description |
PLASTIC, LCC-68
|
CAVITY-UP, CERAMIC, PGA-68
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
25 ns
|
25 ns
|
| Additional Feature |
BYPASS XCVR
|
|
| Clock Frequency-Max (fCLK) |
28.6 MHz
|
20 MHz
|
| Cycle Time |
35 ns
|
50 ns
|
| JESD-30 Code |
S-PQCC-J68
|
S-CPGA-P68
|
| JESD-609 Code |
e0
|
e0
|
| Length |
24.2062 mm
|
|
| Memory Density |
9216 bit
|
18432 bit
|
| Memory IC Type |
BI-DIRECTIONAL FIFO
|
OTHER FIFO
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
512 words
|
1024 words
|
| Number of Words Code |
512
|
1000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
512X18
|
1KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
NO
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
PGA
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
PGA68,11X11
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Standby Current-Max |
0.03 A
|
0.085 A
|
| Supply Current-Max |
0.23 mA
|
0.25 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
24.2062 mm
|
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare IDT72511L25J with alternatives
Compare IDT72225L50GB with alternatives