IDT72404L35P
vs
CY7C402-15DMB
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, DIP-18
0.300 INCH, CERDIP-18
Pin Count
18
18
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
40 ns
Additional Feature
FALL THRU 34NS
BUBBLE BACK 65NS
Clock Frequency-Max (fCLK)
35 MHz
15 MHz
Cycle Time
28.57 ns
66.67 ns
JESD-30 Code
R-PDIP-T18
R-GDIP-T18
JESD-609 Code
e0
e0
Length
22.7965 mm
22.606 mm
Memory Density
320 bit
320 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
5
5
Number of Functions
1
1
Number of Terminals
18
18
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
64X5
64X5
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.191 mm
5.08 mm
Supply Current-Max
0.0725 mA
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Screening Level
38535Q/M;38534H;883B
Compare IDT72404L35P with alternatives
Compare CY7C402-15DMB with alternatives