IDT72401L10SOB
vs
IDT72403L10P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOIC-16
0.300 INCH, PLASTIC, DIP-16
Pin Count
16
16
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
55 ns
55 ns
Additional Feature
FALL THRU 65NS
FALL THRU 65NS
Clock Frequency-Max (fCLK)
10 MHz
10 MHz
Cycle Time
100 ns
100 ns
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
10.3 mm
19.1135 mm
Memory Density
256 bit
256 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
4
4
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
64 words
64 words
Number of Words Code
64
64
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
64X4
64X4
Output Enable
NO
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.4
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
240
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
2.65 mm
4.191 mm
Supply Current-Max
0.045 mA
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
20
Width
7.5 mm
7.62 mm
Base Number Matches
1
5
Output Characteristics
3-STATE
Compare IDT72401L10SOB with alternatives
Compare IDT72403L10P with alternatives