IDT72261LA15PFG8
vs
IDT72V261LA15TF8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
LQFP,
SLIM, TQFP-64
Pin Count
64
64
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
10 ns
10 ns
Additional Feature
RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
RETRANSMIT; AUTO POWER DOWN
Cycle Time
15 ns
15 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e0
Length
14 mm
10 mm
Memory Density
147456 bit
147456 bit
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX9
16KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
30
Width
14 mm
10 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
66.7 MHz
Memory IC Type
OTHER FIFO
Package Equivalence Code
QFP64,.47SQ,20
Standby Current-Max
0.015 A
Supply Current-Max
0.045 mA
Compare IDT72261LA15PFG8 with alternatives
Compare IDT72V261LA15TF8 with alternatives