IDT72251L25JGI
vs
IDT72251L25PFG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFP
Package Description
QCCJ, LDCC32,.5X.6
LQFP, QFP32,.35SQ,32
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
15 ns
Clock Frequency-Max (fCLK)
40 MHz
40 MHz
Cycle Time
25 ns
25 ns
JESD-30 Code
R-PQCC-J32
S-PQFP-G32
JESD-609 Code
e3
e3
Length
13.97 mm
7 mm
Memory Density
73728 bit
73728 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8KX9
8KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LQFP
Package Equivalence Code
LDCC32,.5X.6
QFP32,.35SQ,32
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
1.6 mm
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.05 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn) - annealed
Matte Tin (Sn) - annealed
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
11.43 mm
7 mm
Base Number Matches
2
4
Compare IDT72251L25JGI with alternatives
Compare IDT72251L25PFG with alternatives