IDT72251L25JG8
vs
IDT72251L25PF8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFP
Package Description
QCCJ,
TQFP-32
Pin Count
32
32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
15 ns
Cycle Time
25 ns
25 ns
JESD-30 Code
R-PQCC-J32
S-PQFP-G32
JESD-609 Code
e3
e0
Length
13.97 mm
7 mm
Memory Density
73728 bit
73728 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX9
8KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
LQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
1.6 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
7 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
40 MHz
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
QFP32,.35SQ,32
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.005 A
Supply Current-Max
0.05 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT72251L25JG8 with alternatives
Compare IDT72251L25PF8 with alternatives