IDT72245LB15PF9
vs
IDT72245LB15JI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
LCC
Package Description
PLASTIC, TQFP-64
PLASTIC, LCC-68
Pin Count
64
68
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
25 ns
10 ns
Cycle Time
35 ns
15 ns
JESD-30 Code
S-PQFP-G64
S-PQCC-J68
JESD-609 Code
e0
e0
Length
14 mm
24.2062 mm
Memory Density
147456 bit
73728 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
18
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
64
68
Number of Words
4096 words
4096 words
Number of Words Code
16000
4000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
16KX9
4KX18
Output Characteristics
3-STATE
Output Enable
NO
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
4.572 mm
Supply Current-Max
0.12 mA
0.06 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
14 mm
24.2062 mm
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
66.7 MHz
Package Equivalence Code
LDCC68,1.0SQ
Standby Current-Max
0.005 A
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Compare IDT72245LB15PF9 with alternatives
Compare IDT72245LB15JI with alternatives