IDT72241L25J vs IDT72241L25PFI9 feature comparison

IDT72241L25J Integrated Device Technology Inc

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IDT72241L25PFI9 Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFP
Package Description PLASTIC, LCC-32 LQFP,
Pin Count 32 32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 15 ns
Clock Frequency-Max (fCLK) 40 MHz
Cycle Time 25 ns 25 ns
JESD-30 Code R-PQCC-J32 S-PQFP-G32
JESD-609 Code e0 e0
Length 13.9954 mm 7 mm
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX9 4KX9
Output Characteristics 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 11.4554 mm 7 mm
Base Number Matches 10 1
Supply Current-Max 0.035 mA

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Compare IDT72241L25PFI9 with alternatives