IDT72231L10PF8
vs
72V231L10JG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
Package Description
TQFP-32
QCCJ,
Pin Count
32
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
6.5 ns
6.5 ns
Clock Frequency-Max (fCLK)
100 MHz
Cycle Time
10 ns
10 ns
JESD-30 Code
S-PQFP-G32
R-PQCC-J32
JESD-609 Code
e0
e3
Length
7 mm
13.9954 mm
Memory Density
18432 bit
18432 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2KX9
2KX9
Output Characteristics
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Equivalence Code
QFP32,.35SQ,32
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
3.556 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Width
7 mm
11.4554 mm
Base Number Matches
1
2
Compare IDT72231L10PF8 with alternatives
Compare 72V231L10JG8 with alternatives