IDT72231L10JSCDS-W vs IDT72231L10PFG feature comparison

IDT72231L10JSCDS-W Integrated Device Technology Inc

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IDT72231L10PFG Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 6.5 ns 6.5 ns
Clock Frequency-Max (fCLK) 100 MHz 100 MHz
Cycle Time 10 ns 10 ns
JESD-30 Code R-PQCC-J32 S-PQFP-G32
JESD-609 Code e0 e3
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2KX9 2KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LQFP
Package Equivalence Code LDCC32,.5X.6 QFP32,.35SQ,32
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.05 mA 0.035 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn85Pb15) Matte Tin (Sn) - annealed
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 30
Base Number Matches 1 1
Part Package Code QFP
Package Description LQFP, QFP32,.35SQ,32
Pin Count 32
Length 7 mm
Output Characteristics 3-STATE
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7 mm

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