IDT72225LB35G vs MT53C2K18C3EJ-25TR feature comparison

IDT72225LB35G Integrated Device Technology Inc

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MT53C2K18C3EJ-25TR Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code PGA LCC
Package Description CAVITY-UP, PGA-68 QCCJ,
Pin Count 68 68
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 20 ns
Clock Frequency-Max (fCLK) 28.6 MHz
Cycle Time 35 ns 25 ns
JESD-30 Code S-CPGA-P68 S-PQCC-J68
JESD-609 Code e0 e0
Length 29.464 mm 24.23 mm
Memory Density 18432 bit 36864 bit
Memory IC Type OTHER FIFO
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 1024 words 2048 words
Number of Words Code 1000 2000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX18 2KX18
Output Characteristics 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA QCCJ
Package Equivalence Code PGA68,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY CHIP CARRIER
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.207 mm 5.08 mm
Standby Current-Max 0.07 A
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form PIN/PEG J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 29.464 mm 24.23 mm
Base Number Matches 1 1
Additional Feature RETRANSMIT

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Compare MT53C2K18C3EJ-25TR with alternatives