IDT72225LB10TFG8 vs 72225LB10TFG feature comparison

IDT72225LB10TFG8 Integrated Device Technology Inc

Buy Now Datasheet

72225LB10TFG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP TQFP
Package Description LFQFP, STQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Date Of Intro 1998-02-01 1992-01-01
Access Time-Max 6.5 ns 6.5 ns
Cycle Time 10 ns 10 ns
JESD-30 Code S-PQFP-G64 R-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm
Memory Density 18432 bit 18432 bit
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX18 1KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD QUAD
Width 10 mm
Base Number Matches 1 2
Manufacturer Package Code PPG64
Memory IC Type OTHER FIFO
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA
Time@Peak Reflow Temperature-Max (s) 30

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