IDT72225LB10JG8
vs
72V225L10TFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
Package Description
QCCJ,
STQFP-64
Pin Count
68
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
6.5 ns
6.5 ns
Cycle Time
10 ns
10 ns
JESD-30 Code
S-PQCC-J68
S-PQFP-G64
JESD-609 Code
e3
e3
Length
24.2062 mm
Memory Density
18432 bit
18432 bit
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
68
64
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX18
1KX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
24.2062 mm
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
100 MHz
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
QFP64,.47SQ,20
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.005 A
Supply Current-Max
0.03 mA
Time@Peak Reflow Temperature-Max (s)
30
Compare IDT72225LB10JG8 with alternatives
Compare 72V225L10TFG8 with alternatives