IDT72225LA50G
vs
MS72216-JC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MOSEL-VITELIC
|
| Part Package Code |
PGA
|
LCC
|
| Package Description |
CERAMIC, PGA-68
|
QCCJ,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
25 ns
|
|
| Clock Frequency-Max (fCLK) |
20 MHz
|
|
| Cycle Time |
50 ns
|
20 ns
|
| JESD-30 Code |
S-CPGA-P68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
|
| Memory Density |
18432 bit
|
9216 bit
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
1024 words
|
512 words
|
| Number of Words Code |
1000
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1KX18
|
512X18
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
QCCJ
|
| Package Equivalence Code |
PGA68,11X11
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.06 A
|
|
| Supply Current-Max |
0.25 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Length |
|
24.2316 mm
|
| Width |
|
24.2316 mm
|
|
|
|
Compare IDT72225LA50G with alternatives
Compare MS72216-JC with alternatives