IDT72225LA50G
vs
IDT722605L25J
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PGA
|
|
Package Description |
CERAMIC, PGA-68
|
QCCJ,
|
Pin Count |
68
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
25 ns
|
|
Clock Frequency-Max (fCLK) |
20 MHz
|
|
Cycle Time |
50 ns
|
25 ns
|
JESD-30 Code |
S-CPGA-P68
|
S-PQCC-J68
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
18432 bit
|
9216 bit
|
Memory IC Type |
OTHER FIFO
|
BI-DIRECTIONAL FIFO
|
Memory Width |
18
|
18
|
Number of Functions |
1
|
1
|
Number of Terminals |
68
|
68
|
Number of Words |
1024 words
|
512 words
|
Number of Words Code |
1000
|
512
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
1KX18
|
512X18
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
YES
|
YES
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
PGA
|
QCCJ
|
Package Equivalence Code |
PGA68,11X11
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.06 A
|
|
Supply Current-Max |
0.25 mA
|
0.23 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
PIN/PEG
|
J BEND
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
PERPENDICULAR
|
QUAD
|
Base Number Matches |
1
|
1
|
|
|
|
Compare IDT72225LA50G with alternatives
Compare IDT722605L25J with alternatives