IDT72205LB25TFI
vs
72205LB25TFGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
PLASTIC, STQFP-64
STQFP-64
Pin Count
64
64
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
15 ns
Clock Frequency-Max (fCLK)
40 MHz
Cycle Time
25 ns
25 ns
JESD-30 Code
S-PQFP-G64
R-PQFP-G64
JESD-609 Code
e0
e3
Length
10 mm
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X18
256X18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
Package Equivalence Code
QFP64,.47SQ,20
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
10 mm
Base Number Matches
1
1
Compare IDT72205LB25TFI with alternatives
Compare 72205LB25TFGI with alternatives