IDT72200L35TCB
vs
IDT72200L25TP
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28
0.300 INCH, THIN, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
20 ns
15 ns
Clock Frequency-Max (fCLK)
28.6 MHz
40 MHz
Cycle Time
35 ns
25 ns
JESD-30 Code
R-CDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
35.56 mm
34.671 mm
Memory Density
2048 bit
2048 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256X8
256X8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
4.572 mm
Supply Current-Max
0.1 mA
0.04 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
No
Standby Current-Max
0.005 A
Compare IDT72200L35TCB with alternatives
Compare IDT72200L25TP with alternatives