IDT7216L25J vs IDT7216L25CB feature comparison

IDT7216L25J Integrated Device Technology Inc

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IDT7216L25CB Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC DIP
Package Description PLASTIC, LCC-68 TOP BRAZED, DIP-64
Pin Count 68 64
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 40MHZ 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED @ 40MHZ
Boundary Scan NO NO
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 16 16
JESD-30 Code S-PQCC-J68 R-CDIP-T64
JESD-609 Code e0 e0
Length 24.2062 mm 81.407 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 68 64
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Data Bus Width 16 32
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ DIP
Package Equivalence Code LDCC68,1.0SQ DIP64,.9
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.572 mm
Supply Current-Max 80 mA 100 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 24.2062 mm 22.86 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER DSP PERIPHERAL, MULTIPLIER
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

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