IDT72141S80J
vs
IDT72141S80J8
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
PLASTIC, LCC-32
QCCJ,
Pin Count
32
32
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
80 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
10 MHz
Cycle Time
35.7 ns
35.7 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e0
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4KX9
4KX9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
SERIAL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.008 A
Supply Current-Max
0.14 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
1
1
Pbfree Code
No
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