IDT7202LA50D vs 5962-9158504MYX feature comparison

IDT7202LA50D Rochester Electronics LLC

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5962-9158504MYX Integrated Device Technology Inc

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Length 37.211 mm
Memory Density 9216 bit 9216 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1KX9 1KX9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 5.08 mm
Supply Current-Max 0.08 mA 0.115 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 2 4
Part Package Code DIP
Pin Count 28
Qualification Status Not Qualified
Screening Level MIL-STD-883

Compare IDT7202LA50D with alternatives

Compare 5962-9158504MYX with alternatives