IDT7202LA25JGI8 vs 7202LA25JG feature comparison

IDT7202LA25JGI8 Integrated Device Technology Inc

Buy Now Datasheet

7202LA25JG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ QFJ
Package Description QCCJ, GREEN, PLASTIC, LCC-32
Pin Count 32 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 35 ns 35 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e3 e3
Length 13.97 mm 13.97 mm
Memory Density 9216 bit 9216 bit
Memory IC Type BI-DIRECTIONAL FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1KX9 1KX9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.55 mm 3.55 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN Matte Tin (Sn) - annealed
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Width 11.43 mm 11.43 mm
Base Number Matches 1 2
Clock Frequency-Max (fCLK) 28.5 MHz
Moisture Sensitivity Level 3
Package Equivalence Code LDCC32,.5X.6
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.005 A
Supply Current-Max 0.08 mA
Time@Peak Reflow Temperature-Max (s) 30

Compare IDT7202LA25JGI8 with alternatives

Compare 7202LA25JG with alternatives