IDT7201SA35TP
vs
7201LA35J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
PLCC
Package Description
DIP, DIP28,.3
PLASTIC, LCC-32
Pin Count
28
32
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
35 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
22.22 MHz
22.2 MHz
Cycle Time
45 ns
45 ns
JESD-30 Code
R-PDIP-T28
R-PQCC-J32
JESD-609 Code
e0
e0
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512X9
512X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP28,.3
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.0005 A
Supply Current-Max
0.125 mA
0.125 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
Pbfree Code
Manufacturer Package Code
PL32
Length
13.97 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
225
Seated Height-Max
3.55 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
11.43 mm
Compare IDT7201SA35TP with alternatives
Compare 7201LA35J with alternatives