IDT7201LA50TDGB vs IDT7201LA50JGB feature comparison

IDT7201LA50TDGB Integrated Device Technology Inc

Buy Now Datasheet

IDT7201LA50JGB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP QFJ
Package Description DIP, QCCJ,
Pin Count 28 32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDIP-T28 R-PQCC-J32
JESD-609 Code e3 e3
Length 37.1475 mm 13.97 mm
Memory Density 4608 bit 4608 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X9 512X9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B MIL-STD-883 Class B
Seated Height-Max 5.08 mm 3.55 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 11.43 mm
Base Number Matches 1 1

Compare IDT7201LA50TDGB with alternatives

Compare IDT7201LA50JGB with alternatives