IDT7201LA50TDG vs 7201LA50TDGB feature comparison

IDT7201LA50TDG Integrated Device Technology Inc

Buy Now Datasheet

7201LA50TDGB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP
Package Description DIP, DIP, DIP28,.3
Pin Count 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT
Cycle Time 65 ns
JESD-30 Code R-GDIP-T28 R-XDIP-T28
JESD-609 Code e3 e3
Length 37.1475 mm
Memory Density 4608 bit
Memory Width 9 9
Number of Functions 1
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512X9 512X9
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 15 MHz
Memory IC Type OTHER FIFO
Package Equivalence Code DIP28,.3
Standby Current-Max 0.015 A
Supply Current-Max 0.1 mA

Compare IDT7201LA50TDG with alternatives

Compare 7201LA50TDGB with alternatives