IDT7201LA50TCB
vs
SN74ACT7201LA50DV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28
SOP-28
Pin Count
28
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-30 Code
R-CDIP-T28
R-PDSO-G28
JESD-609 Code
e0
e0
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
512X9
512X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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