IDT7201LA50TCB vs 7201LA50DBG feature comparison

IDT7201LA50TCB Integrated Device Technology Inc

Buy Now Datasheet

7201LA50DBG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description 0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28 DIP,
Pin Count 28 28
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 80 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 65 ns 100 ns
JESD-30 Code R-CDIP-T28 R-GDIP-T28
JESD-609 Code e0 e3
Memory Density 4608 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X9 4KX9
Output Characteristics 3-STATE
Output Enable NO YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883 Class B
Supply Current-Max 0.14 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Length 37.211 mm
Seated Height-Max 5.08 mm
Width 15.24 mm

Compare IDT7201LA50TCB with alternatives

Compare 7201LA50DBG with alternatives