IDT7201LA30DGB vs IDT7201LA30TPGB feature comparison

IDT7201LA30DGB Integrated Device Technology Inc

Buy Now Datasheet

IDT7201LA30TPGB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP,
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 30 ns 30 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 40 ns 40 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e3 e3
Length 37.211 mm 34.671 mm
Memory Density 4608 bit 4608 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X9 512X9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B MIL-STD-883 Class B
Seated Height-Max 5.08 mm 4.572 mm
Standby Current-Max 0.015 A
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.62 mm
Base Number Matches 1 1

Compare IDT7201LA30DGB with alternatives

Compare IDT7201LA30TPGB with alternatives