Findchips: Compare IDT7201L50P vs 5962-8986303XX

IDT7201L50P vs 5962-8986303XX feature comparison

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Buy Now

Rohs Code	No
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	INTEGRATED DEVICE TECHNOLOGY INC	QP SEMICONDUCTOR INC
Reach Compliance Code	not_compliant	unknown
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.71	8542.32.00.71
Access Time-Max	50 ns	50 ns
Cycle Time	65 ns	65 ns
JESD-30 Code	R-PDIP-T28	R-XDIP-T28
JESD-609 Code	e0
Memory Density	4608 bit	4608 bit
Memory IC Type	OTHER FIFO
Memory Width	9	9
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Terminals	28	28
Number of Words	512 words	512 words
Number of Words Code	512	512
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	70 °C	125 °C
Operating Temperature-Min		-55 °C
Organization	512X9	512X9
Output Enable	NO	NO
Package Body Material	PLASTIC/EPOXY	UNSPECIFIED
Package Code	DIP	DIP
Package Equivalence Code	DIP28,.6
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Cel)	240
Qualification Status	Not Qualified	Not Qualified
Supply Current-Max	0.125 mA
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	MILITARY
Terminal Finish	TIN LEAD
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	20
Base Number Matches	1	4
Package Description		DIP,
Additional Feature		RETRANSMIT
Length		37.211 mm
Seated Height-Max		5.08 mm
Supply Voltage-Max (Vsup)		5.5 V
Supply Voltage-Min (Vsup)		4.5 V
Width		15.24 mm
	Memory » FIFOs	Memory » FIFOs