IDT7200S50XEB
vs
7200L50TPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DFP
DIP
Package Description
CERPACK-28
THIN, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
Cycle Time
65 ns
65 ns
JESD-30 Code
R-GDFP-F28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
18.288 mm
34.67 mm
Memory Density
2304 bit
2304 bit
Memory IC Type
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256X9
256X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.921 mm
4.57 mm
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
12.446 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Moisture Sensitivity Level
3
Compare IDT7200S50XEB with alternatives
Compare 7200L50TPB with alternatives