IDT7200S50XEB vs 7200L50TPB feature comparison

IDT7200S50XEB Integrated Device Technology Inc

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7200L50TPB Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DFP DIP
Package Description CERPACK-28 THIN, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT
Cycle Time 65 ns 65 ns
JESD-30 Code R-GDFP-F28 R-PDIP-T28
JESD-609 Code e0 e0
Length 18.288 mm 34.67 mm
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256X9 256X9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DFP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.921 mm 4.57 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 12.446 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Moisture Sensitivity Level 3

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