IDT7200S35XE
vs
IDT7200L35J8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DFP
QFJ
Package Description
CERPACK-28
PLASTIC, LCC-32
Pin Count
28
32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
35 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
45 ns
45 ns
JESD-30 Code
R-GDFP-F28
R-PQCC-J32
JESD-609 Code
e0
e0
Length
18.288 mm
13.97 mm
Memory Density
2304 bit
2304 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X9
256X9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.921 mm
3.55 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
FLAT
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
12.446 mm
11.43 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
22.2 MHz
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
1
Package Equivalence Code
LDCC32,.5X.6
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.0005 A
Supply Current-Max
0.125 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare IDT7200S35XE with alternatives
Compare IDT7200L35J8 with alternatives