IDT7200S25J8
vs
IDT7200L25JGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
PLASTIC, LCC-32
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
25 ns
25 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
35 ns
35 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
e3
Memory Density
2304 bit
2304 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256X9
256X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn) - annealed
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
28.5 MHz
Length
13.97 mm
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
1
Package Equivalence Code
LDCC32,.5X.6
Peak Reflow Temperature (Cel)
260
Power Supplies
5 V
Seated Height-Max
3.55 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.08 mA
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
11.43 mm
Compare IDT7200S25J8 with alternatives
Compare IDT7200L25JGI with alternatives