IDT7200L65P
vs
AM7200-65/BXA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
Package Description
0.600 INCH, PLASTIC, DIP-28
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
65 ns
65 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
12.5 MHz
12.5 MHz
Cycle Time
80 ns
80 ns
JESD-30 Code
R-PDIP-T28
R-CDIP-T28
JESD-609 Code
e0
e0
Memory Density
2304 bit
2304 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
256X9
256X9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0005 A
0.005 A
Supply Current-Max
0.08 mA
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
1
2
Pbfree Code
Length
37.1475 mm
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.588 mm
Width
15.24 mm
Compare IDT7200L65P with alternatives
Compare AM7200-65/BXA with alternatives