IDT7200L50SOG8
vs
7200L50J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
SOIC
PLCC
Package Description
PLASTIC, SOIC-28
PLASTIC, LCC-32
Pin Count
28
32
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
50 ns
50 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Clock Frequency-Max (fCLK)
15 MHz
15 MHz
Cycle Time
65 ns
65 ns
JESD-30 Code
R-PDSO-G28
R-PQCC-J32
JESD-609 Code
e3
e0
Length
18.3642 mm
13.97 mm
Memory Density
2304 bit
2304 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256X9
256X9
Output Characteristics
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
QCCJ
Package Equivalence Code
SOP28,.5
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.048 mm
3.55 mm
Standby Current-Max
0.005 A
0.0005 A
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
20
Width
8.763 mm
11.43 mm
Base Number Matches
1
1
Manufacturer Package Code
PL32
Compare IDT7200L50SOG8 with alternatives
Compare 7200L50J with alternatives