IDT7200L50L8 vs IDT7200S50XEB feature comparison

IDT7200L50L8 Integrated Device Technology Inc

Buy Now Datasheet

IDT7200S50XEB Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFJ DFP
Package Description LCC-32 CERPACK-28
Pin Count 32 28
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 65 ns 65 ns
JESD-30 Code R-CQCC-N32 R-GDFP-F28
JESD-609 Code e0 e0
Memory Density 2304 bit 2304 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 256X9 256X9
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD FLAT
Terminal Position QUAD DUAL
Base Number Matches 1 1
Length 18.288 mm
Memory IC Type OTHER FIFO
Seated Height-Max 2.921 mm
Supply Current-Max 0.1 mA
Terminal Pitch 1.27 mm
Width 12.446 mm

Compare IDT7200L50L8 with alternatives

Compare IDT7200S50XEB with alternatives