IDT7200L35L vs IDT7200L35TP feature comparison

IDT7200L35L Integrated Device Technology Inc

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IDT7200L35TP Rochester Electronics LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code QFJ
Package Description LCC-32 DIP,
Pin Count 32
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
Additional Feature RETRANSMIT RETRANSMIT
Clock Frequency-Max (fCLK) 22.2 MHz
Cycle Time 45 ns 45 ns
JESD-30 Code R-CQCC-N32 R-PDIP-T28
JESD-609 Code e0 e0
Memory Density 2304 bit 2304 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256X9 256X9
Output Characteristics 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCN DIP
Package Equivalence Code LCC32,.45X.55
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Standby Current-Max 0.0005 A
Supply Current-Max 0.125 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Base Number Matches 1 2
Length 34.671 mm
Seated Height-Max 4.572 mm
Width 7.62 mm

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