IDT7200L25TDG vs CY7C419-25JIR feature comparison

IDT7200L25TDG Integrated Device Technology Inc

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CY7C419-25JIR Cypress Semiconductor

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP QFJ
Package Description DIP, DIP28,.3 QCCJ,
Pin Count 28 32
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT RETRANSMIT
Clock Frequency-Max (fCLK) 28.5 MHz
Cycle Time 35 ns 35 ns
JESD-30 Code R-GDIP-T28 R-PQCC-J32
JESD-609 Code e3
Length 37.1475 mm 13.97 mm
Memory Density 2304 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 256 words 256 words
Number of Words Code 256 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256X9 512X9
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 3.55 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.08 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 7.62 mm 11.43 mm
Base Number Matches 3 1
Output Characteristics 3-STATE

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Compare CY7C419-25JIR with alternatives