IDT71V659S80BG
vs
IDT71T657S80PF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
QFP
Package Description
BGA,
LQFP,
Pin Count
119
100
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
8 ns
8 ns
Additional Feature
ALSO REQUIRES 2.5V I/O SUPPLY
JESD-30 Code
R-PBGA-B119
R-PQFP-G100
JESD-609 Code
e0
e0
Length
22 mm
20 mm
Memory Density
9437184 bit
9437184 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
36
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
119
100
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX18
256KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
BOTTOM
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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